Hdts Print ^hot^ -

| Property | Value | |----------|-------| | Density | 19.0–19.3 g/cm³ (≥99.95% pure) | | Melting Point | 3422°C | | Thermal Conductivity | 173 W/(m·K) | | Coefficient of Thermal Expansion | 4.5 µm/(m·K) | | Hardness (sintered) | 300–400 HV | | Tensile Strength | 500–750 MPa |

This is the most common method for applying tungsten patterns onto ceramic or metal substrates. hdts print

| Advantages | Limitations | |------------|--------------| | Enables complex, lightweight shielding geometries | High material cost (tungsten powder $200–400/kg) | | Eliminates machining of brittle tungsten | Sintering requires high-temperature furnaces (≥1500°C) | | Fine features down to 10 µm (AJP) | Printed parts are porous unless HIP treated | | Reduced waste vs. subtractive methods | Oxygen contamination leads to embrittlement | | Allows multi-material prints (e.g., W-Cu) | Limited build size (typically ≤300 mm) | | Property | Value | |----------|-------| | Density | 19