PANEL: 4 × 6 array (24 total) V-score: 30°, remaining thickness 0.3 mm (1.0 mm board) Breakaway tabs: 3 per side, width 4 mm, mouse-bite perforated Tooling rails: top/bottom 12 mm Tooling holes: 4 × ø3.175 mm ±0.05 Fiducials: 3 × 1.0 mm copper, open mask Depanelization: Routing depanelizer only (no manual snap) Component keepout: 3 mm from V-score, 2 mm from tabs
This document defines the requirements for (panels) to optimize SMT line throughput, reduce handling costs, and ensure safe depanelization. It applies to all PCB assemblies containing multiple individual boards connected by breakaway rails or tabs. multi board assembly
system-level synchronization to ensure that mechanical fit and electrical connectivity are maintained across all interfaces. Cadence Design Systems +1 Key Components Child Boards: The individual PCBs (e.g., Motherboard, Daughterboard, Wi-Fi module). Interconnects: Board-to-board connectors, headers, or ribbon cables. System Enclosure: The mechanical housing that defines the physical constraints for all internal boards. Cadence Design Systems +1 2. Design Workflow and Best Practices Designing for multi-board systems involves several critical phases beyond standard layout: A. Logical System Connection Before physical layout, designers must define the logical "wiring" between boards. Net Management: Mapping signals from one board's connector to another to verify mating and pinout accuracy. Unified Library Management: Ensuring that component symbols and footprints are consistent across the entire multi-board project. Nine Dot Connects +1 B. 3D Integration and Collision Detection A primary benefit of MBA software is the ability to place and check components in a 3D environment. Altium Mechanical Clearance: Visualizing obstacles to avoid errors during initial placement. Collision Testing: Checking for intersections between 3D bodies, such as tall capacitors hitting a neighboring board or enclosure wall. Connector Mating: Verifying that male/female connectors align perfectly in 3D space. Altium +2 C. Rigidity and Stability Because multi-board systems often face mechanical stress, the assembly must account for: Vibration Mitigation: The enclosure and mounting points must protect the assembly from shock. Panelization: Ensuring the panel design is not too large for the board thickness to prevent "bounce" or flexibility issues during manufacturing. Cadence Design Systems +1 3. Documentation and Manufacturing Handoff Detailed documentation is essential to prevent assembly errors at the contract manufacturer (CM). 11 sites The Role of CAD in Design: Synthesizing ECAD and MCAD Feb 16, 2023 — PANEL: 4 × 6 array (24 total) V-score: