| Error Code | Description | Solution | | :--- | :--- | :--- | | | Vacuum Leak | Check collet for blockage; check air tubing connections. | | E-205 | Fiducial Not Found | Clean substrate; adjust lighting intensity in recipe settings. | | E-302 | Pick Failure | Check wafer tape stickiness; adjust pick height or bond force. | | E-404 | Dispenser Timeout | Check for clogged nozzle; clean the needle tip. |
Driven by high-speed linear motors that offer rapid acceleration while minimizing structural vibrations. datacon 2200 evo manual pdf
The comprehensive operational manual can be accessed directly through the Besi Customer Area or referenced via standardized interface documentation such as the Scribd Datacon 2200 SECS/GEM Manual . Core Hardware Architecture | Error Code | Description | Solution |
The is a fully automatic, high-speed die bonder designed for high-mix, small-batch production environments. It utilizes a vision-based placement system to handle various die sizes (from small image sensors to larger power devices) with sub-micron placement accuracy. | | E-404 | Dispenser Timeout | Check
The DataCon 2200 EVO is a cutting-edge data logging and communication device designed for industrial applications. To ensure optimal performance and troubleshooting, it's essential to have a thorough understanding of the device's features and operations. The DataCon 2200 EVO manual PDF provides users with a comprehensive guide to configuring, operating, and maintaining the device.
