Multi-board Design -

These figures provide a visual representation of the concepts discussed in this paper, offering a deeper understanding of the principles and challenges associated with multi-board design.

Specialized boards can be stacked or connected via flexible interposers to fit into compact or irregularly shaped enclosures.

Multi-board design involves dividing a complex system into smaller, manageable subsystems, each implemented on a separate PCB. These PCBs are then interconnected to form the complete system. The design process typically involves the following steps:

Common families: Samtec, Hirose DF13/DF63, JST PH/XH, TE AMPMODU, PCIe/M.2 edge connectors.